In its fifth edition, the flagship industry conference Hong Kong FinTech Week this year is launching a unique Global Fast Track Programme to help worldwide including Singapore innovative technology companies connect with the leading financial institutions, investors and regulators in Hong Kong.

Selected candidates will have a rare opportunity to pitch their solution directly to senior executives of Corporate Champions, including AMTD Group, Hong Kong Exchange, Microsoft, and also regulators including Hong Kong Monetary Authority. The program is free to participate in with an application deadline on 31 August 2020.

Successful applicants will be matched for one-to-one video meetings, designed to deepen discussions around opportunities for collaboration, partnerships and business deals. The best of the best are invited to pitch at Hong Kong Fintech Week in front of a panel of investors, for a chance to win up to USD 1 million of investment commitment, subject to due diligence.

The Global Fast Track Programme focuses on eight key FinTech verticals: Capital Markets, Payments, Retail Banking, Commercial Banking, WealthTech, RegTech, Insurance and Trade Finance. Global FinTech companies are invited to apply online now – the programme is completely free to participate in and it can be completed virtually online from anywhere in the world.

Read more at Fintech News Singapore!

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